高電流インダクタ用絶縁材料とコイルの製造プロセスの開発
Development of Coil Fabrication Process and Insulation Materials for High Current Inductors
- 提供方法
- 本サイト上にてダウンロード・閲覧可
- 形態
- 価格
- 一般価格(税込)：￥1,100 会員価格(税込)：￥880
- 文献番号
- 20117265
- 文献・情報種別
- その他の国際会議
No.2011-39-7265
- 掲載ページ
- 1-4(Total 4 p)
- 発行年月
- 2011年 5月
- 出版社
- その他・不明
- 言語
- 英語
- イベント
- EVTeC'11
書誌事項
| カテゴリ（英） | Wireless Power Transmission 翻訳 |
|---|---|
| 著者（英） | 1) Yasushi Murakami, 2) Shohei Hosoo, 3) Michio Tatsuno |
| 勤務先（英） | 1) Shinshu University, 2) Shinshu University, 3) Tokyo Seiden Co., Ltd. |
| 抄録 | 本研究ではワイヤレス給電用コイルの作製のため，コイルの製造プロセスと高い熱伝導性を有する材料と絶縁方法の研究を行った．銅板をプレス成形で折り曲げる製法を用い，更に新しい絶縁被覆についても開発を行った．この結果熱伝導率は0.83w/mKを得る事が可能となった． |
| 抄録（英） | In order to make the wireless power transfer system, the fabrication process of coils and the design of electric insulation and high thermal conductive materials are proposed by taking high current inductor system as an analogy. The fabrication process of the coil is developed for high current inductors. The copper plate is pressed and folded double at two fulcrum points to produce coils. The developed process restrains the cracks in the coil, compared with the conventional process involving the bend of rectangular wire in the lateral direction. The electric insulation coatings on the coil are developed. The electrical breakdown strength of the developed coatings is slightly higher than that containing polyamideimides. The developed material has a higher thermal conductivity of 0.83 W/m K. The high thermal conductive potting materials are developed to use between the coil unit and the aluminum case. The developed potting material has low viscosity (7.2 Pa s at 60°C), high thermal conductivity (6.2 W/m K), high glass-transition temperature, high thermal shock resistance and high volume resistivity compared to conventional one containing silicon rubber and Al₂O₃. 翻訳 |
