Soldering Materials and Technology for the Power Electronics
パワーエレクトロニクスに対応したはんだ材料の展開
- Delivery
- Available on this site
- Format
- Price
- Non-members (tax incl.):¥1,100 Members (tax incl.):¥880
- Publication code
- 20224574
- Paper/Info type
- Journal of Society of Automotive Engineers of Japan
Vol.76 No.11
- Pages
- 26-30(Total 5 p)
- Date of publication
- Nov 2022
- Publisher
- JSAE
- Language
- Japanese
Detailed Information
Category(J) | CASEを支える最新カーエレクトロニクス Translation |
---|---|
Category(E) | Latest Car Electronics supporting CASE |
Author(J) | 1) 竹政 哲 |
Author(E) | 1) Tetsu Takemasa |
Affiliation(J) | 1) 千住金属工業 |
Abstract(J) | 自動車をはじめとする輸送機器では,燃費の向上やCO2排出量削減の観点から電動化が進んでおり,車載パワーデバイスの更なる性能向上が求められている. 本項では,パワーデバイスの実装に適したはんだ材料や工法に加え,SiCやGaNなどの次世代半導体の実装を見据えた高信頼性はんだ合金や近年注目度の高いAg焼結技術を紹介する. Translation |
Abstract(E) | Recently, the power devices for automobiles have been increasing for the improvement of fuel efficiency and the reduction of CO2 emission. This section introduces solder materials and methods suitable for mounting next-generation semiconductors such as SiC and GaN in addition to Si power devices, as well as highly reliable solder alloys and Ag sintering technology, which has attracted much attention in recent years. |