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  • Summary & Details

Palm-size LiDAR for Long-Range High-Resolution Range-Imaging

長距離・高解像距離計測が可能な手のひらサイズLiDAR

Detailed Information

Category(J)ホットトピックス

Translation

Category(E)Hot Topics
Author(J)1) 崔 明秀
Author(E)1) Akihide Sai
Affiliation(J)1) 東芝
Abstract(J)自動運転車の実現にあたっては、レベル4以上の安全・確実な自動運転プログラムを立ち上げるために、長距離(200m)かつ高画質な深度センサーが不可欠である。本稿では、高性能で手のひらサイズのLiDARを実現するための2つの必須技術、高電圧/低電圧ハイブリッドトランジスタで構成されるアクティブクエンチング(AQ)-SIPMとデジタルSiPM特性補償(DSCC)回路について紹介する。 ハイブリッド AQ 回路により高い PDE を確保しながら画素領域を縮小した高画素密度2D-SiPMアレイ、および、受光レンズと受光ユニットの小型化により、手のひらサイズで高解像度の手のひらサイズLiDARを実現した。 DSCC は、外部コンポーネントを使用せずにオンチップの半導体プロセスと温度依存による特性変動を補償することで、高い耐環境性能の LiDAR 実現に貢献する。 これらの技術により、受光ユニットを世界最小サイズの64ccに小型化し、機械式に匹敵する測距性能を備えた合計350ccサイズのLiDARを実現した。

Translation

Abstract(E)Upon realizing a self-driven car, long-range (200m) and high image quality depth sensors are essential for launching safe and reliable self-driving programs of Level 4 and above. This paper presents two essential techniques, Active-Quenching (AQ) -SIPM consisting of hybrid High-voltage/Low-voltage transistors and Digital SiPM Characteristic Compensation (DSCC) circuit to realize high-performance and palm-size LiDAR. The hybrid AQ circuit shrinks a pixel area while ensures a high PDE. The high pixel density 2D-SiPM array realizes high image-resolution palm-size LiDAR with palm size by reducing light-receiving lens and RX unit size. The DSCC provides an on-chip Process/Temperature (PT) calibration without external components, which contributes to weather-ability assurance and LiDAR miniaturization. These technologies downsize LiDAR RX to the world’s smallest size, 64cc, and realize a total 350cc-size LiDAR with the competitive performance as a mechanical one.

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