New Material and Bonding Technology for High-Frequency Printed Circuit Board Compatible with Next-Generation Communications
次世代通信対応高周波プリント配線板向け新規材料と接着技術
- Delivery
- Available on this site
- Format
- Price
- Non-members (tax incl.):¥1,100 Members (tax incl.):¥880
- Publication code
- 20244280
- Paper/Info type
- Journal of Society of Automotive Engineers of Japan
Vol.78 No.5
- Pages
- 100-107(Total 8 p)
- Date of publication
- May 2024
- Publisher
- JSAE
- Language
- Japanese
Detailed Information
Category(J) | ホットトピックス Translation |
---|---|
Category(E) | Hot Topics |
Author(J) | 1) 八甫谷 明彦 |
Author(E) | 1) Akihiko Happoya |
Affiliation(J) | 1) ダイセル |
Abstract(J) | 次世代情報通信システムでは、高周波領域での高速信号の品質を確保するために、伝送損失の低減が必要である。 次世代通信用高周波プリント基板の伝送損失を低減するために、(1)低誘電正接と難燃性を両立した熱硬化性樹脂、(2)界面修飾化学結合技術による樹脂と平滑銅箔との高信頼性接着技術を開発した。 Translation |
Abstract(E) | In next-generation information and communication systems, reducing transmission loss is necessary to ensure the quality of highspeed signals in the high frequency domain. In order to reduce transmission loss in high-frequency printed circuit board for nextgeneration communications, we developed(1) thermosetting resins that are both low dielectric loss tangent and flame retardant, and(2)highly reliable adhesive technology between resin and smooth copper foil created by surface-modified chemical bonding. |