Fatigue Simulation Process for Solder-Joints of Electronic Components Considering Vibration and Shock Loads
プリント基板上の電子部品のはんだ接合部に対する疲労解析手法の提案
- Delivery
- Available on this site
- Format
- Price
- Non-members (tax incl.)：￥1,100 Members (tax incl.)：￥880
- Publication code
- 20215254
- Paper/Info type
- Proceedings (Spring)
No.57-21
- Pages
- 1-6(Total 6 p)
- Date of publication
- May 2021
- Publisher
- JSAE
- Language
- Japanese
- Event
- 2021 JSAE Annual Congress (Spring)[Online Meeting]
Detailed Information
| Author(J) | 1) 加藤 一正, 2) 山川 雅敏, 3) 村松 憲幸, 4) Harald Ziegelwanger, 5) Walter Hinterberger, 6) Helmut Dannbauer |
|---|---|
| Author(E) | 1) Kazumasa Kato, 2) Masatoshi Yamakawa, 3) Noriyuki Muramatsu, 4) Harald Ziegelwanger, 5) Walter Hinterberger, 6) Helmut Dannbauer |
| Affiliation(J) | 1) マグナ･インターナショナル･ジャパン, 2) マグナ･インターナショナル･ジャパン, 3) マグナ･インターナショナル･ジャパン, 4) Magna Powertrain, 5) Magna Powertrain, 6) Magna Powertrain |
| Affiliation(E) | 1) Magna International Japan, 2) Magna International Japan, 3) Magna International Japan, 4) Magna Powertrain, 5) Magna Powertrain, 6) Magna Powertrain |
| Abstract(J) | 駆動系部品の電動化に伴い，機械的な衝撃や振動入力に耐える駆動系部品を制御する電子部品の開発が要求されている．そのため，CAEによる疲労強度評価が難しい，はんだ接合部の疲労評価が重要である．本講演では，プリント基板上のはんだ接合部の疲労強度解析プロセスを提案し，本手法の適用事例を紹介する． Translation |
| Abstract(E) | The trend towards electrification of the powertrain requires the development of electronic components that can withstand vibrations and mechanical shocks. A major challenge in this context is the fatigue strength of solder joints, for which these loads are usually considered to be an undesirable condition. In this lecture, a comprehensive simulation process for fatigue strength assessment of solder joints is presented. Since the number of solder joints on a single printed circuit board is usually in the range of several thousands, the core of the proposed process is the automatic FE-model generation of surface mount devices and solder-joints. |
