Considerations and Countermeasures for Reliability Design of BGA Solder Joints
BGAはんだ接合の信頼性設計への検討と対策
- Delivery
- Available on this site
- Format
- Price
- Non-members (tax incl.)：￥1,100 Members (tax incl.)：￥880
- Publication code
- 20266124
- Paper/Info type
- Proceedings (Autumn)
No.118-26
- Pages
- 1-2(Total 2 p)
- Date of publication
- Oct 2026
- Publisher
- JSAE
- Language
- Japanese
- Event
- 2026 JSAE Annual Congress (Autumn)
Detailed Information
| Author(J) | 1) 西森 久雄, 2) 武藤 潤, 3) 柴田 靖文 |
|---|---|
| Author(E) | 1) Hisao Nishimori, 2) Jun Muto, 3) Yasufumi Shibata |
| Affiliation(J) | 1) トヨタ自動車, 2) トヨタ自動車, 3) トヨタ自動車 |
| Affiliation(E) | 1) Toyota Motor, 2) Toyota Motor, 3) Toyota Motor |
| Abstract(J) | 電子部品の高機能化では外観検査できないBGAはんだ接合を同一基板上に多数実装する設計となり，故障モードを理解した製品設計と製造工程で品質を作りこむ必要がある．BGAはんだ接合状態を非破壊と破壊解析により把握し，製造品質を含む信頼性の高い設計に向け，国際規格も活用した検討内容について紹介する． Translation |
| Abstract(E) | As electronic components become more advanced, designs increasingly place many BGAs—whose solder joints cannot be inspected visually—on the same board. This makes it essential to develop product designs and manufacturing processes that build in quality based on an understanding of failure modes. By characterizing BGA solder-joint conditions through both non-destructive and destructive analyses, this presentation introduces approaches to achieving robust designs that include manufacturing quality, drawing on international standards as part of the evaluation. |
