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Summary & Details

Guidelines for quality management methods for zero-defects of automotive semiconductor devices

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Format: PDF

Price: Non-members (tax incl.)：￥3,300 Members (tax incl.)：￥2,640

Paper/Info type: JASO Technical Paper

No.TP-25002

Date of publication: Mar 2025

Publisher: JSAE

Language: English

Detailed Information

Scope	This technical paper applies to management methods for assuring the quality of semiconductor devices and products (hereinafter referred to as “semiconductor products) for vehicles. The two main objectives of this standard are as follows. a) Although AEC-Q100, AEC-Q004, IATF 16949, and other global standards exist for the purpose of achieving the levels of quality and reliability demanded of automotive semiconductor products, these standards do not include various additional requirements based on the know-how of Japan-affiliated manufacturers. This technical paper describes the merits and reasoning related to quality improvement and the like that is achieved by adding these requirements, which are commonly held between Japan-affiliated manufacturers, to global standards. b) Previously, JASO TP 22001 was established to describe guidelines for quality verification methods related to product change notifications (PCNs) and JASO TP 24001 was established to describe guidelines for quality verification methods related to the new production part approval process (PPAP), resulting in the standardization of individual requirements held by individual Japan-affiliated manufacturers as common items. This technical paper describes the reasoning behind and necessity for individual requirements established by these Japan-affiliated manufacturers. In addition to semiconductor manufacturers, this technical paper also aims to describe guidelines for quality assurance established in cooperation across the whole supply chain, including automakers and electronic control unit (ECU) manufacturers.

Scope

This technical paper applies to management methods for assuring the quality of semiconductor devices and products (hereinafter referred to as “semiconductor products) for vehicles. The two main objectives of this standard are as follows.
a) Although AEC-Q100, AEC-Q004, IATF 16949, and other global standards exist for the purpose of achieving the levels of quality and reliability demanded of automotive semiconductor products, these standards do not include various additional requirements based on the know-how of Japan-affiliated manufacturers. This technical paper describes the merits and reasoning related to quality improvement and the like that is achieved by adding these requirements, which are commonly held between Japan-affiliated manufacturers, to global standards.
b) Previously, JASO TP 22001 was established to describe guidelines for quality verification methods related to product change notifications (PCNs) and JASO TP 24001 was established to describe guidelines for quality verification methods related to the new production part approval process (PPAP), resulting in the standardization of individual requirements held by individual Japan-affiliated manufacturers as common items. This technical paper describes the reasoning behind and necessity for individual requirements established by these Japan-affiliated manufacturers.
In addition to semiconductor manufacturers, this technical paper also aims to describe guidelines for quality assurance established in cooperation across the whole supply chain, including automakers and electronic control unit (ECU) manufacturers.

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