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2121 to 2130 of 162,014

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Effects of Aluminum Laser Welding Conditions and Quality Factors on Weld Strength

Publication code
20235067
Author(main)
Junyeong Jeong (Hyundai Motor)
Paper/Info type
Proceedings (Spring)
Date of publication
May 2023

No.16-23

Notch Bending Fatigue Analyses on a Steel Sheet Based on Fracture Mechanics

Publication code
20235066
Author(main)
Gyoko Oh (Tokyo Roki)
Paper/Info type
Proceedings (Spring)
Date of publication
May 2023

No.15-23

Multi Part Integration Approach for Body Structure using Breakthrough Laser Welded Blanks Solutions with the 2nd Generation of High Bending Coated Steel for Hot Stamping

Publication code
20235065
Author(main)
Jesse Paegle (ArcelorMittal)
Paper/Info type
Proceedings (Spring)
Date of publication
May 2023

No.15-23

Development of the Die Coatings Suitable for Hot Stamping

Publication code
20235064
Author(main)
Kento Tamura (Ibaraki University)
Paper/Info type
Proceedings (Spring)
Date of publication
May 2023

No.15-23

Technology to Improve the Endurance of Coated Dies in Press Working of Ultra-High Tensile Strength Steel

Publication code
20235063
Author(main)
Nanako Seki (Ibaraki University)
Paper/Info type
Proceedings (Spring)
Date of publication
May 2023

No.15-23

Proposal for Improving Accuracy of Board Thermal Model Compatible with VHDL-AMS

Publication code
20235062
Author(main)
Yoshinori Aruga (KOA)
Paper/Info type
Proceedings (Spring)
Date of publication
May 2023

No.14-23

Next Generation DXRC Modeling for BGA Packages to Streamline ECU Design

Publication code
20235061
Author(main)
Hiroki Nakamizo (Tokyo Institute of Technolory)
Paper/Info type
Proceedings (Spring)
Date of publication
May 2023

No.14-23

New Standard DXRC: Thermal Analysis Model for Semiconductor Packages

Publication code
20235060
Author(main)
Haruki Takei (Siemens)
Paper/Info type
Proceedings (Spring)
Date of publication
May 2023

No.14-23

Proposal for Heat Loss Calculation by Dynamic Actuator Modeling

Publication code
20235059
Author(main)
Masashi Inaba (DENSO)
Paper/Info type
Proceedings (Spring)
Date of publication
May 2023

No.14-23

Optimized Location Design of Thermal Interfacial Material by using Semiconductor Model

Publication code
20235058
Author(main)
Kazunari Hashimoto (DENSO)
Paper/Info type
Proceedings (Spring)
Date of publication
May 2023

No.13-23

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