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Clarification of Damage Mechanism of Dies in Press Working of Aluminum Alloy

Publication code
20235069
Author(main)
Ryu Yoshiura (Ibaraki University)
Paper/Info type
Proceedings (Spring)
Date of publication
May 2023

No.16-23

Effect of Heating on Mechanical Properties in Warm and Hot Tube Gas Forming of Aluminum Alloy Tube without Post-Heat Treatment

Publication code
20235068
Author(main)
Tomoyoshi Maeno (Yokohama National University)
Paper/Info type
Proceedings (Spring)
Date of publication
May 2023

No.16-23

Effects of Aluminum Laser Welding Conditions and Quality Factors on Weld Strength

Publication code
20235067
Author(main)
Junyeong Jeong (Hyundai Motor)
Paper/Info type
Proceedings (Spring)
Date of publication
May 2023

No.16-23

Notch Bending Fatigue Analyses on a Steel Sheet Based on Fracture Mechanics

Publication code
20235066
Author(main)
Gyoko Oh (Tokyo Roki)
Paper/Info type
Proceedings (Spring)
Date of publication
May 2023

No.15-23

Multi Part Integration Approach for Body Structure using Breakthrough Laser Welded Blanks Solutions with the 2nd Generation of High Bending Coated Steel for Hot Stamping

Publication code
20235065
Author(main)
Jesse Paegle (ArcelorMittal)
Paper/Info type
Proceedings (Spring)
Date of publication
May 2023

No.15-23

Development of the Die Coatings Suitable for Hot Stamping

Publication code
20235064
Author(main)
Kento Tamura (Ibaraki University)
Paper/Info type
Proceedings (Spring)
Date of publication
May 2023

No.15-23

Technology to Improve the Endurance of Coated Dies in Press Working of Ultra-High Tensile Strength Steel

Publication code
20235063
Author(main)
Nanako Seki (Ibaraki University)
Paper/Info type
Proceedings (Spring)
Date of publication
May 2023

No.15-23

Proposal for Improving Accuracy of Board Thermal Model Compatible with VHDL-AMS

Publication code
20235062
Author(main)
Yoshinori Aruga (KOA)
Paper/Info type
Proceedings (Spring)
Date of publication
May 2023

No.14-23

Next Generation DXRC Modeling for BGA Packages to Streamline ECU Design

Publication code
20235061
Author(main)
Hiroki Nakamizo (Tokyo Institute of Technolory)
Paper/Info type
Proceedings (Spring)
Date of publication
May 2023

No.14-23

New Standard DXRC: Thermal Analysis Model for Semiconductor Packages

Publication code
20235060
Author(main)
Haruki Takei (Siemens)
Paper/Info type
Proceedings (Spring)
Date of publication
May 2023

No.14-23

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