Proposal of Man-Hour Reduction in Experiments by Utilizing MBD in Cooperation with Tier 1 and Tier 2 Modeling of Passive Components Compatible with VHDL-AMS and Utilization of the Model
Tier1，Tier2 MBD連携による実験工数削減 VHDL-AMS対応受動部品モデルと活用
- Delivery
- Available on this site
- Format
- Price
- Non-members (tax incl.)：￥1,100 Members (tax incl.)：￥880
- Publication code
- 20225069
- Paper/Info type
- Proceedings (Spring)
No.16-22
- Pages
- 1-6(Total 6 p)
- Date of publication
- May 2022
- Publisher
- JSAE
- Language
- Japanese
- Event
- 2022 JSAE Annual Congress (Spring)
Detailed Information
| Author(J) | 1) 有賀 善紀, 2) 向山 大索, 3) 上田 雅生, 4) 篠田 卓也, 5) 田岡 直人, 6) 武井 春樹, 7) 瀧澤 登, 8) 江上 孝夫, 9) 有本 志峰 |
|---|---|
| Author(E) | 1) Yoshinori Aruga, 2) Daisaku Mukaiyama, 3) Masanari Ueda, 4) Takuya Shinoda, 5) Naoto Taoka, 6) Haruki Takei, 7) Noboru Takizawa, 8) Takao Egami, 9) Shiho Arimoto |
| Affiliation(J) | 1) KOA, 2) ルビコン, 3) シーメンスEDAジャパン, 4) デンソー, 5) IDAJ, 6) シーメンス, 7) 無所属, 8) 東芝デバイス&ストレージ, 9) 日立Astemo |
| Affiliation(E) | 1) KOA, 2) Rubycon, 3) Siemens Electronic Design Automation Japan, 4) DENSO, 5) IDAJ, 6) Siemens, 7) Unaffiliated, 8) Toshiba Electronic Devices & Storage, 9) Hitachi Astemo |
| Abstract(J) | 小型・高機能化が進む車載電装機器の熱設計では、主な発熱源の半導体だけでなく、その周辺回路で用いられる受動部品（抵抗・コンデンサ等）への考慮も重要である。本報告では、回路・熱連成解析に活用が進むVHDL-AMSに対応した受動部品モデルを提案する。また、具体例での解析結果と設計効率向上について示す。 Translation |
| Abstract(E) | In-vehicle electrical equipment is becoming smaller and more sophisticated. For the thermal design of these devices, it is important to consider not only the semiconductors, which are the main heat source, but also the passive components (resistors, capacitors) used in the peripheral circuits. In this paper, we propose a passive component model compatible with VHDL-AMS, which has been widely used for multi-domain analysis of circuits and heat. The analysis results and the improvement of design efficiency in the concrete example are also shown. |
