Ground Plane Interactions in Electromagnetic Compatibility Component Testing
- 提供方法
- 版元よりダウンロードリンクを連絡
- 形態
- 価格
- 一般価格(税込)：￥6,600 会員価格(税込)：￥5,280
- 文献・情報種別
- SAE Paper
No.2022-01-0130
- 掲載ページ
- 1-8(Total 8 p)
- 発行年月
- 2022年 3月
- 出版社
- SAE International
- 言語
- 英語
- イベント
- WCX SAE World Congress Experience 2022
書誌事項
| 著者（英） | 1) Douglas Andrew Sims, 2) Scott Piper |
|---|---|
| 勤務先（英） | 1) General Motors LLC, 2) General Motors LLC |
| 抄録（英） | The automotive industry has increased reliance on electronics technology and wireless communication systems and the demand for these systems is still increasing. With this demand there is a need to ensure these systems do not interfere with each other in a way which may cause system performance degradation or even failure. Electromagnetic compatibility (EMC) is a discipline that deals with interaction between electronic and wireless systems. During EMC testing the device under test (DUT) is isolated from the surrounding environment to facilitate measurement of the component’s electromagnetic characteristics. Geometric aspects of an EMC test setup may impact test results without the knowledge of the test engineer. In this paper, electromagnetic simulation and measurement results will show the impact of one of the least obvious but most often experienced issues in an EMC setup - grounding. Grounding issues will be illustrated for low frequency magnetic field, radio frequency, and conducted emissions measurements. This paper provides EMC labs guidance in selecting the best possible test configurations which result in better test procedures and outcomes. 翻訳 |
